Flip Chip Market Size, Share, Growth Analysis, By Packaging Type (FC BGA, QFN), By Industry (Electronics, Automotive), By Bumping Technology (Copper Pillar, Solder Bumping), By Region -Industry Forecast 2024-2031
Report ID:
SQMIG45I2208 |
Region:
Global |
Published Date: November, 2024
Pages:
192
|Tables:
0
|Figures:
0
Flip Chip Market Insights
Global Flip chip Market size was valued at USD 30.5 Billion in 2022 and is poised to grow from USD 32.43 Billion in 2023 to USD 49.74 Billion by 2031, growing at a CAGR of 6.3% during the forecast period (2024-2031).
Rapidly increasing digitization around the world has led to a major upsurge in the demand for novel semiconductors and chips. The increasing need for device miniaturization and advancements in semiconductor technologies are forecasted to bolster the demand for flip chips over the coming years. The growing use of Internet of Things (IoT) devices and the advent of 5G network technologies are also creating new opportunities for flip chip providers. Electrification of vehicles has also led to a major hike in demand for automotive electronics thereby favoring flip chip market growth potential as well. Rising popularity and demand for high performance computing and increasing establishment of advanced data centers are also estimated to favor sales of flip chips across the world going forward. On the contrary, complexities in thermal management, availability of alternative packaging solutions, and high initial investments for deployment are some key constraints that slow down flip chip market development.
Market Snapshot - (2024-2031)
Global Market Size
Largest Segment
Fastest Growth
Growth Rate
CAGR
To get more reports on the above market click here to Buy The Report
Flip Chip Market Segmental Analysis
Global Flip chip Market is segmented by packaging type, packaging technology, bumping technology, Product, industry and Region. Based on packaging technology, the market is segmented into 3D IC, 5D IC, 2D IC. Based on packaging type, the market is segmented into FC BGA, FC PGA, FC LGA, FC QFN, FC SiP, FC CSP. Based on bumping technology, the market is segmented into Copper Pillar, Solder Bumping, Tin-lead Eutectic Solder, Lead-free Solder, Gold Bumping, Others (Aluminum & Conductive Polymer). Based on Product, the market is segmented into Memory, LED, CMOS Image sensor, RF, Analog, Mixed Signal, and Power IC, CPU, SoC, GPU. In terms of industry, the market is segmented into Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others. Based on region, the market is segmented into North America, Europe, Asia-Pacific, Latin America and Middle East & and Africa.
Analysis by Packaging Type
FC BGA (Flip Chip Ball Grid Assay) packaging is projected to account for a dominant share of the global flip chip market. Use of this type of packaging allows companies to create chips and semiconductors that have better input and output flexibility along with reduced size and weight as well. Growing demand for miniaturization of electronics will surely help promote the dominance of this segment in the future. Telecommunication and consumer electronics industries are forecasted to take the lead when it comes to the adoption of FC BGA packaging type in the long run.
However, the demand for QFN (Quad Flat No-Lead) packaging type is estimated to increase in popularity at a notable pace over the coming years. Reduced complexity of circuits and better thermal and electric performance are the top benefits of QFN packaging that help this segment emerge as a highly opportune one for flip chip companies. Low costs and easy handling are also other properties that will push flip chip providers towards QFN packaging across the forecast period and beyond. Automotive electronics are projected to be key end users of this packaging type along with smartphones and other mobile devices in the future.
Analysis by Industry
The electronics industry is forecasted to spearhead the demand for flip chip technology across the study period and beyond. Growing demand for novel electronic products, increasing sales of consumer electronics, and high investments in the development of novel electronic components are estimated to help this segment hold its high market share and attract more flip chip companies. The advent of Internet of Things, 5G, and wearable device technologies is also expected to benefit the high market share of this segment in the long run. Device miniaturization is also a trend that will boost sales of flip chips.
Meanwhile, the demand for flip chips in the automotive industry is forecasted to rise at a notable pace in the future. Growing electrification of vehicles around the world to curb emissions and rising popularity of electric vehicles are slated to promote the demand for flip chip in this segment going forward. High use of advanced electronic safety and driver assistance systems along with advanced infotainment systems is also predicted to create new opportunities for flip chip companies in this segment through 2031 and beyond. Germany, India, China, Japan, and South Korea are slated to be the key markets for flip chip companies looking to make mark in this segment
To get detailed analysis on other segments, Request For Free Sample Report
Flip Chip Market Regional Insights
India, China, Japan, and South Korea are home to some of the biggest semiconductor manufacturing companies in the world. This makes the Asia Pacific region a hot spot for flip chip companies and the largest regional market as well. Rising sales of consumer electronics, the presence of top semiconductor manufacturers, and the imposition of strict vehicle emission reduction mandates are helping this region maintain its dominant stance. The growing disposable income of people in this region will be a factor driving up the demand for flip chips going forward. Increasing digital transformation in this region will also promote flip chip market growth in the future.
Meanwhile, the demand for flip chip in the North American region accounts for the second-largest share of the global flip chip market. Growing emphasis on governments in this region to reduce their reliance on semiconductor imports and expand semiconductor manufacturing is projected to create new opportunities for flip chip companies. Supportive government funding has led to increasing establishment of new semiconductor manufacturing facilities in this region thereby uplifting the demand for flip chips as well. Canada and the United States are estimated to remain the top markets for all flip chip companies looking to make mark in the North American landscape.
- Largest
- Fastest
To know more about the market opportunities by region and country, click here to
Buy The Complete Report
Flip Chip Market Dynamics
Drivers
Use of Automotive Electronics
- The automotive industry is undergoing some major changes as the use of semiconductors and electronics increases. Rising popularity of electric vehicles and advanced safety systems and infotainment systems are bolstering the demand for automotive semiconductors and thereby also favoring flip chip market growth as well.
Emphasis on Device Miniaturization
- Miniaturization of devices and technology has become a prominent trend across the world as the need for more functionality in a small form factor is increasing. Flip technology plays a crucial role in reducing the overall size and weight of a semiconductor or chip and this is why device miniaturization trend is driving market development.
Restraints
Complexity in Manufacturing
- Flip chip technology is much more complex than the traditional packaging approach as it involves multiple steps such as wafer bumping, underfill, and die attach, which increases the complexity of the overall manufacturing process. This complexity results in high costs and thereby impedes flip chip demand outlook going forward.
Availability of Alternative Packaging Solutions
- Flip chips are not the only novel technology available for packaging semiconductors. The availability of an-out wafer-level packaging (FOWLP) and 2.5D/3D packaging among others is estimated to slow down the demand for flip chips across the forecast period and beyond. End users tend to opt for alternative technologies due to their simple nature.
Request Free Customization of this report to help us to meet your business objectives.
Flip Chip Market Competitive Landscape
Companies operating in the flip chip market should focus on reducing the complexity and costs of flip chip adoption. Growing demand for devie miniaturization will be the top opportunity for new as well as established flip chip companies going forward. Targeting countries with high automotive manufacturing activity could also offer lucrative business scope for market players in the long run.
Top Player’s Company Profiles
- IBM Corporation
- ASE Technology Holding Co., Ltd.
- Advanced Micro Devices, Inc.
- Intel Corporation
- Fujitsu
- Texas Instruments Incorporated
- Fujitsu Ltd.
- 3M
- Powertech Technology Inc.
- Samsung Electronics Co. Ltd.
- TSMC Ltd.,
- Apple Inc.
- AMD Inc.
Recent Developments
- Zavus Xtreme Pixel (XP) Flip Chip COB MicroLED, a new display solution was launched by Jupiter Systems in March 2023. The new product features a novel Flip Chip Common Cathode COB technology that helps in improving the energy efficiency of this new display by around 30% and making it a suitable choice for energy conscious users.
- TongFu Microelectronics Co. Ltd., a renowned provider of semiconductor manufacturing services based in China is investing in the construction of a Tongfu Tongda Advanced Packaging Base. The new facility is expected to be completed by 2029 and is primarily focusing on multi-layer stacking, flip-chip, wafer-level, and panel-level packaging.
- In December 2023, Toppan, a renowned Japanese tech organization signed a sales and purchase agreement with JOLED Inc. Under this agreement Toppan will build a production line for Flip Chip Ball Grid Arrays (FC-BGAs) which are high-density semiconductor packages used in data centers and other applications.
Flip Chip Key Market Trends
- Emphasis on Sustainability: flip chip companies should focus on the development and use of lead-free solder technologies for packaging to comply with modern sustainability standards. Moreover, imposition of bans on the use of toxic chemicals and materials will also push flip chip companies to innovate and look for new materials for their offerings.
- Use Of Hybrid Bonding: Flip chip companies can explore the idea of combining copper-to-copper bonding with traditional flip chip interconnects. To create hybrid bonding techniques. Moreover, combining other advanced technologies can also help improve the scope of application for flip chip companies in the long run. Use of these hybrid bonding technologies and techniques could help companies stand out from their competition in the long run.
Flip Chip Market SkyQuest Analysis
SkyQuest’s ABIRAW (Advanced Business Intelligence, Research & Analysis Wing) is our Business Information Services team that Collects, Collates, Correlates, and Analyses the Data collected by means of Primary Exploratory Research backed by robust Secondary Desk research.
As per SkyQuest analysis, advancements in semiconductor technologies and high demand for energy-efficient electronics are projected to drive demand for flip chips over the coming years. On the contrary, complexity in manufacturing and availability of alternative packaging solutions are slated to impede market growth. Asia Pacific is slated to dominate the global flip chip market owing to the presence of a strong semiconductor manufacturing industry in this region. Use of hybrid bonding and elimination of toxic materials from the packaging process are expected to provide attractive opportunities for flip chip companies in the future.
| Report Metric | Details |
|---|---|
| Market size value in 2022 | USD 30.5 Billion |
| Market size value in 2031 | USD 49.74 Billion |
| Growth Rate | 6.3% |
| Base year | 2023 |
| Forecast period | (2024-2031) |
| Forecast Unit (Value) | USD Billion |
| Segments covered |
|
| Regions covered | North America (US, Canada), Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe), Asia Pacific (China, India, Japan, Rest of Asia-Pacific), Latin America (Brazil, Rest of Latin America), Middle East & Africa (South Africa, GCC Countries, Rest of MEA) |
| Companies covered |
|
| Customization scope | Free report customization with purchase. Customization includes:-
|
To get a free trial access to our platform which is a one stop solution for all your data requirements for quicker decision making. This platform allows you to compare markets, competitors who are prominent in the market, and mega trends that are influencing the dynamics in the market. Also, get access to detailed SkyQuest exclusive matrix.
Buy The Complete Report to read the analyzed strategies adopted by the top vendors either to retain or gain market share
Table Of Content
Executive Summary
Market overview
- Exhibit: Executive Summary – Chart on Market Overview
- Exhibit: Executive Summary – Data Table on Market Overview
- Exhibit: Executive Summary – Chart on Flip Chip Market Characteristics
- Exhibit: Executive Summary – Chart on Market by Geography
- Exhibit: Executive Summary – Chart on Market Segmentation
- Exhibit: Executive Summary – Chart on Incremental Growth
- Exhibit: Executive Summary – Data Table on Incremental Growth
- Exhibit: Executive Summary – Chart on Vendor Market Positioning
Parent Market Analysis
Market overview
Market size
- Market Dynamics
- Exhibit: Impact analysis of DROC, 2021
- Drivers
- Opportunities
- Restraints
- Challenges
- Exhibit: Impact analysis of DROC, 2021
- SWOT Analysis
KEY MARKET INSIGHTS
- Technology Analysis
- (Exhibit: Data Table: Name of technology and details)
- Pricing Analysis
- (Exhibit: Data Table: Name of technology and pricing details)
- Supply Chain Analysis
- (Exhibit: Detailed Supply Chain Presentation)
- Value Chain Analysis
- (Exhibit: Detailed Value Chain Presentation)
- Ecosystem Of the Market
- Exhibit: Parent Market Ecosystem Market Analysis
- Exhibit: Market Characteristics of Parent Market
- IP Analysis
- (Exhibit: Data Table: Name of product/technology, patents filed, inventor/company name, acquiring firm)
- Trade Analysis
- (Exhibit: Data Table: Import and Export data details)
- Startup Analysis
- (Exhibit: Data Table: Emerging startups details)
- Raw Material Analysis
- (Exhibit: Data Table: Mapping of key raw materials)
- Innovation Matrix
- (Exhibit: Positioning Matrix: Mapping of new and existing technologies)
- Pipeline product Analysis
- (Exhibit: Data Table: Name of companies and pipeline products, regional mapping)
- Macroeconomic Indicators
COVID IMPACT
- Introduction
- Impact On Economy—scenario Assessment
- Exhibit: Data on GDP - Year-over-year growth 2016-2022 (%)
- Revised Market Size
- Exhibit: Data Table on Flip Chip Market size and forecast 2021-2027 ($ million)
- Impact Of COVID On Key Segments
- Exhibit: Data Table on Segment Market size and forecast 2021-2027 ($ million)
- COVID Strategies By Company
- Exhibit: Analysis on key strategies adopted by companies
MARKET DYNAMICS & OUTLOOK
- Market Dynamics
- Exhibit: Impact analysis of DROC, 2021
- Drivers
- Opportunities
- Restraints
- Challenges
- Exhibit: Impact analysis of DROC, 2021
- Regulatory Landscape
- Exhibit: Data Table on regulation from different region
- SWOT Analysis
- Porters Analysis
- Competitive rivalry
- Exhibit: Competitive rivalry Impact of key factors, 2021
- Threat of substitute products
- Exhibit: Threat of Substitute Products Impact of key factors, 2021
- Bargaining power of buyers
- Exhibit: buyers bargaining power Impact of key factors, 2021
- Threat of new entrants
- Exhibit: Threat of new entrants Impact of key factors, 2021
- Bargaining power of suppliers
- Exhibit: Threat of suppliers bargaining power Impact of key factors, 2021
- Competitive rivalry
- Skyquest special insights on future disruptions
- Political Impact
- Economic impact
- Social Impact
- Technical Impact
- Environmental Impact
- Legal Impact
Market Size by Region
- Chart on Market share by geography 2021-2027 (%)
- Data Table on Market share by geography 2021-2027(%)
- North America
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- USA
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Canada
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Europe
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- Germany
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Spain
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- France
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- UK
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of Europe
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Asia Pacific
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- China
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- India
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Japan
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- South Korea
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of Asia Pacific
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Latin America
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- Brazil
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of South America
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Middle East & Africa (MEA)
- Chart on Market share by country 2021-2027 (%)
- Data Table on Market share by country 2021-2027(%)
- GCC Countries
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- South Africa
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
- Rest of MEA
- Exhibit: Chart on Market share 2021-2027 (%)
- Exhibit: Market size and forecast 2021-2027 ($ million)
KEY COMPANY PROFILES
- Competitive Landscape
- Total number of companies covered
- Exhibit: companies covered in the report, 2021
- Top companies market positioning
- Exhibit: company positioning matrix, 2021
- Top companies market Share
- Exhibit: Pie chart analysis on company market share, 2021(%)
- Total number of companies covered
Methodology
For the Flip Chip Market, our research methodology involved a mixture of primary and secondary data sources. Key steps involved in the research process are listed below:
1. Information Procurement: This stage involved the procurement of Market data or related information via primary and secondary sources. The various secondary sources used included various company websites, annual reports, trade databases, and paid databases such as Hoover's, Bloomberg Business, Factiva, and Avention. Our team did 45 primary interactions Globally which included several stakeholders such as manufacturers, customers, key opinion leaders, etc. Overall, information procurement was one of the most extensive stages in our research process.
2. Information Analysis: This step involved triangulation of data through bottom-up and top-down approaches to estimate and validate the total size and future estimate of the Flip Chip Market.
3. Report Formulation: The final step entailed the placement of data points in appropriate Market spaces in an attempt to deduce viable conclusions.
4. Validation & Publishing: Validation is the most important step in the process. Validation & re-validation via an intricately designed process helped us finalize data points to be used for final calculations. The final Market estimates and forecasts were then aligned and sent to our panel of industry experts for validation of data. Once the validation was done the report was sent to our Quality Assurance team to ensure adherence to style guides, consistency & design.
Analyst Support
Customization Options
With the given market data, our dedicated team of analysts can offer you the following customization options are available for the Flip Chip Market:
Product Analysis: Product matrix, which offers a detailed comparison of the product portfolio of companies.
Regional Analysis: Further analysis of the Flip Chip Market for additional countries.
Competitive Analysis: Detailed analysis and profiling of additional Market players & comparative analysis of competitive products.
Go to Market Strategy: Find the high-growth channels to invest your marketing efforts and increase your customer base.
Innovation Mapping: Identify racial solutions and innovation, connected to deep ecosystems of innovators, start-ups, academics, and strategic partners.
Category Intelligence: Customized intelligence that is relevant to their supply Markets will enable them to make smarter sourcing decisions and improve their category management.
Public Company Transcript Analysis: To improve the investment performance by generating new alpha and making better-informed decisions.
Social Media Listening: To analyze the conversations and trends happening not just around your brand, but around your industry as a whole, and use those insights to make better Marketing decisions.
USA (+1) 351-333-4748
