Global Flip Chip Market

Flip Chip Market Size, Share, Growth Analysis, By Packaging Type, By Packaging Technology, By Bumping Technology, By End Use, By Region -Industry Forecast 2025-2032

Report ID: SQMIG45I2223 | Region: Global | Published Date: December, 2024
Pages: 192 | Tables: 161 | Figures: 71

Flip Chip Market News

  • Zavus Xtreme Pixel (XP) Flip Chip COB MicroLED, a new display solution was launched by Jupiter Systems in March 2023. The new product features a novel Flip Chip Common Cathode COB technology that helps in improving the energy efficiency of this new display by around 30% and making it a suitable choice for energy conscious users.
  • TongFu Microelectronics Co. Ltd., a renowned provider of semiconductor manufacturing services based in China is investing in the construction of a Tongfu Tongda Advanced Packaging Base. The new facility is expected to be completed by 2029 and is primarily focusing on multi-layer stacking, flip-chip, wafer-level, and panel-level packaging.
  • In December 2023, Toppan, a renowned Japanese tech organization signed a sales and purchase agreement with JOLED Inc. Under this agreement Toppan will build a production line for Flip Chip Ball Grid Arrays (FC-BGAs) which are high-density semiconductor packages used in data centers and other applications.
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FAQs

Global Flip chip Market size was valued at USD 30.5 Billion in 2022 and is poised to grow from USD 32.43 Billion in 2023 to USD 49.74 Billion by 2031, growing at a CAGR of 6.3% during the forecast period (2024-2031). 

Companies operating in the flip chip market should focus on reducing the complexity and costs of flip chip adoption. Growing demand for devie miniaturization will be the top opportunity for new as well as established flip chip companies going forward. Targeting countries with high automotive manufacturing activity could also offer lucrative business scope for market players in the long run. 'IBM Corporation ', 'ASE Technology Holding Co., Ltd. ', 'Advanced Micro Devices, Inc. ', 'Intel Corporation ', 'Fujitsu ', 'Texas Instruments Incorporated ', 'Fujitsu Ltd. ', '3M ', 'Powertech Technology Inc. ', 'Samsung Electronics Co. Ltd. ', 'TSMC Ltd., ', 'Apple Inc. ', 'AMD Inc. ', 'Amkor Technology ', 'International business machines corporation '

The automotive industry is undergoing some major changes as the use of semiconductors and electronics increases. Rising popularity of electric vehicles and advanced safety systems and infotainment systems are bolstering the demand for automotive semiconductors and thereby also favoring flip chip market growth as well.

Emphasis on Sustainability: flip chip companies should focus on the development and use of lead-free solder technologies for packaging to comply with modern sustainability standards. Moreover, imposition of bans on the use of toxic chemicals and materials will also push flip chip companies to innovate and look for new materials for their offerings.

India, China, Japan, and South Korea are home to some of the biggest semiconductor manufacturing companies in the world. This makes the Asia Pacific region a hot spot for flip chip companies and the largest regional market as well. Rising sales of consumer electronics, the presence of top semiconductor manufacturers, and the imposition of strict vehicle emission reduction mandates are helping this region maintain its dominant stance. The growing disposable income of people in this region will be a factor driving up the demand for flip chips going forward. Increasing digital transformation in this region will also promote flip chip market growth in the future.

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Global Flip Chip Market

Report ID: SQMIG45I2223

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