Global IC Packaging Market

IC Packaging Market Size, Share, Growth Analysis, By Type(DIP, SOP, QFP, QFN), By Bonding Techniques(Wire Bonding, Flip Chips, Wafer Level Packaging, Others), By Application(Memory IC, Logic IC, Discrete, SIP), By Region - Industry Forecast 2024-2031

Report ID: SQMIG45N2089 | Region: Global | Published Date: July, 2001
Pages: 221 | Tables: 100 | Figures: 76

IC Packaging Market Regional Insights

The global IC packaging market is segmented based on the geography of North America, Europe, and Asia-Pacific. Among these regions, the Asia-Pacific region is projected to hold the most dominating share of more than 90% in the market. The major aspect that drives the regional growth of the market includes the presence of major IC packaging and assembly companies in the region. The Asia-Pacific region is considered the major hub for IC assembly and packaging across the globe. Countries such as Taiwan, China, Japan, and South Korea are among the key contributors to the regional growth of the market.

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FAQs

IC Packaging Market size was valued at USD 37.76 billion in 2019 and is poised to grow from USD 40.94 billion in 2023 to USD 77.89 billion by 2031, growing at a CAGR of 8.37% in the forecast period (2024-2031).

The IC Packaging market is relatively fragmented, with a high level of competition. The prominent players operating in the market are constantly adopting various growth strategies to stay afloat in the market. Product launches, innovations, mergers, and acquisitions, collaborations and partnerships, and intensive R&D are some of the growth strategies that are adopted by these key players to thrive in the competitive market. The key market players are also constantly focused on R&D to supply industries with the most efficient and cost-effective solutions. 'Amkor Technology', 'ASE Group', 'STATS ChipPAC', 'Siliconware Precision Industries Co. Ltd.', 'Jiangsu Changjiang Electronics Technology Co. Ltd.', 'Powertech Technology Inc.', 'UTAC Holdings Ltd.', 'Chipbond Technology Corporation', 'King Yuan Electronics Co., Ltd.', 'TongFu Microelectronics Co., Ltd.', 'Nepes Corporation', 'Advanced Semiconductor Engineering Inc.', 'Shinko Electric Industries Co. Ltd.', 'Kyocera Corporation', 'Samsung Electro-Mechanics Co. Ltd.', 'Fujitsu Limited', 'JCET Group Co., Ltd.', 'Texas Instruments Incorporated', 'Infineon Technologies AG', 'NXP Semiconductors N.V.'

Rising government support is anticipated to drive the semiconductor and IC packaging market. For instance, Creating Helpful Incentives to Produce Semiconductors for America Act or the CHIPS for America Act establishes investments and incentives to support U.S. semiconductor manufacturing, research and development, and supply chain security.

This strong demand for ICs for various applications across the globe has led to the shortage of ICs. The IC packaging industry may face challenges in the future. Apart from these, natural calamities such as drought in Taiwan also led to a crisis in the IC industry in the country. Hence, these are some of the factors that challenge the growth of the market.

The IC packaging market is segmented based on the geography of North America, Europe, and Asia-Pacific. Among these regions, the Asia-Pacific region is projected to hold the most dominating share of more than 90% in the market. The major aspect that drives the regional growth of the market includes the presence of major IC packaging and assembly companies in the region. The Asia-Pacific region is considered the major hub for IC assembly and packaging across the globe. Countries such as Taiwan, China, Japan, and South Korea are among the key contributors to the regional growth of the market.

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Global IC Packaging Market

Report ID: SQMIG45N2089

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