Self-Healing Material Market Size, Share, Growth Analysis, By Form(Intrinsic, Extrinsic), By Product(Polymer, concrete, metal, coating), By Application(Energy, Generation, Building, Construction), By Technology(Reversible Polymers, Microencapsulation, Shape Memory material, Biological Material system.), By Region - Industry Forecast 2024-2031

Self-Healing Material Market Driver

• Concrete is a conventional material used for building and construction activities. It is widely used in constructing infrastructure like dams, ports, storage tank, roads, tunnels, subways, and others. It is strong and durable, it also has a high tendency to form cracks, allowing various unwanted aggressive chemicals and other materials to seep in. These cracks and the deposition of chemicals into cracks cause deterioration of the infrastructure and reduce the same durability. Active treatment technique are operated to treat such damage. Self-healing technique have the ability to repair the crack by self-healing mechanism allow rapid treatment. Due to shortcoming of such treatment some advance and innovative treatment method like self-healing and encapsulation of polymeric material are high in demand. Adoption of such technique boost market growth.

Self-Healing Material Market Restraint

• Self-healing mechanism material is limited in design. The encapsulated healing agents are microscopic and thus prevent the compromising of the overall reliability of material. The tiny size of capsule limits the amount of healing agents in the materials. This ultimately constraints the amount of damage the healing agent can repair.
• High elastic polymers, regardless of having high elasticity, cannot withstand pressure at times. Microcapsules are similar to high elastic polymers and cannot withstand much external force. The limited microcapsule holding capacity of materials coupled with irreversible process of capsules rupture is expected to limit the ability to repair the material. This shortcoming of the product is expected to limit the market growth.