Global Semiconductor Etch Equipment Market

Semiconductor Etch Equipment Market Size, Share, Growth Analysis, By Product Type(High-density etch equipment, and low-density etch equipment.), By Process(Dielectric etch, and conductor etch), By End-use(Integrated device manufacturers, foundry, and memory manufacturers.), By Region - Industry Forecast 2024-2031

Report ID: SQMIG45N2098 | Region: Global | Published Date: May, 2024
Pages: 197 | Tables: 88 | Figures: 69

Semiconductor Etch Equipment Market News

  • In April 2023- Hitachi High-Tech Corporation announced that it would construct a new production facility in the Kasado Area of Kudamatsu City, Yamaguchi Prefecture, to increase the production capacity of etching systems for its semiconductor manufacturing equipment business, with production scheduled to begin in FY2025.
  • In December 2022: Applied Materials announced its intention to make significant investments in its innovation infrastructure in the United States and expand its global manufacturing capacity up to 2030. These investments are expected to enhance customer collaboration for accelerating improvements in semiconductor performance, power, and cost, besides enabling the company to increase equipment manufacturing capacity.
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Semiconductor Etch Equipment Market size was valued at USD 24.04 billion in 2022 and is poised to grow from USD 26.04 billion in 2023 to USD 45.5 billion by 2031, growing at a CAGR of 8.32% in the forecast period (2024-2031).

The semiconductor etch equipment market is characterized by intense competition among key players striving to maintain their market positions, innovate, and meet the evolving demands of semiconductor manufacturers worldwide. Leading companies in the semiconductor etch equipment market include Applied Materials Inc., Lam Research Corporation, Tokyo Electron Limited (TEL), ASML Holding NV, Hitachi High-Technologies Corporation, and SCREEN Semiconductor Solutions Co., Ltd., among others. 'Applied Materials Inc.', 'Lam Research Corporation', 'Tokyo Electron Limited (TEL)', 'ASML Holding NV', 'Hitachi High-Technologies Corporation', 'SCREEN Semiconductor Solutions Co., Ltd.', 'Panasonic Industry Co., Ltd.', 'Shenzhen Delphi Laser & Robot Co., Ltd.', 'Applied Materials, Inc.', 'Ulvac,', 'Spts technologies ltd.', 'Samco inc.', 'EV Group (EVG)'

Continuous advancements in semiconductor technology, including shrinking feature sizes, increasing integration densities, and the development of new materials, drive the demand for advanced semiconductor etch equipment. As semiconductor manufacturers strive to meet the requirements of next-generation devices, they require etch equipment capable of achieving higher precision, resolution, and process control.

Advanced Packaging Technologies:

The dominant and fastest-growing region in the semiconductor etch equipment market is typically East Asia, particularly driven by countries like China, South Korea, Japan, and Taiwan. This dominance is rooted in several key factors that characterize the semiconductor industry landscape in this region. Firstly, East Asia has established itself as a hub for semiconductor manufacturing, with major players like Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and SK Hynix heavily invested in semiconductor fabrication facilities. These companies, along with numerous other semiconductor manufacturers, contribute significantly to the semiconductor demand etch equipment. Secondly, East Asia benefits from a robust ecosystem that supports semiconductor research, development, and production. The region boasts a highly skilled workforce, strong government support, and a dense network of semiconductor-related companies, suppliers, and service providers. This ecosystem fosters innovation, collaboration, and knowledge exchange, further driving the growth of the semiconductor industry.

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Global Semiconductor Etch Equipment Market

Report ID: SQMIG45N2098

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