Semiconductor Production Equipment Market Size, Share, Growth Analysis, By Front-end Equipment Type(Lithography (DUV Lithography, EUV Lithography), Water Surface Conditioning Equipment (Etching, Chemical Mechanical Planarization (CMP))), By Back-end Equipment type(Wafer Testing/ IC Testing, Assembly & Packaging Equipment, Dicing, Metrology), By Fab Facility Equipment type(Automation, Chemical Control, Gas Control, Others), By Product type(Discrete, Foundry, MPU, memory), By Dimension(2 Dimension, 2.5 Dimension, and 3 Dimension), By Supply Chain Process(IDM, OSAT, and Foundry), By End User Industry(Computers & Peripherals, consumer electronics, telecommunication equipment, industrial equipment), By Region - Industry Forecast 2024-2031

Semiconductor Production Equipment Market size was valued at USD 67.69 billion in 2019 and is poised to grow from USD 95.70 billion in 2023 to USD 192.52 billion by 2031, growing at a CAGR of 9.13% during the forecast period (2024-2031).

The global semiconductor production equipment market is highly competitive and dynamic as a result of continuous innovations and ever-increasing requirement for semiconductors devices. In the market, powerful players from the industry fight for dominating the market via product performance, technical innovation, pricing strategies and global distribution networks. Constant flow of investments into products’ research and development accompanied with the adoption of revolutionary methods by market players is regarded as the source of domination on the market. The competitive industry landscape is mainly defined by the strategic partnerships, collaborations, and acquisitions taken by market parties to target the market reach and enhance the product portfolio. Furthermore, the industry is being populated by startups converging on cutting edge technologies in their particular markets, which increases the competition and accelerates the pace of innovation in semiconductor manufacturing technology. 'Applied Materials, Inc.', 'ASML Holding NV', 'Lam Research Corporation', 'Hitachi High Technologies Corporation ', 'Ultratech, Inc. ', 'Nova Measuring Instruments Ltd. ', 'KLA-Tencor Corporation ', 'Screen Holdings Co., Ltd. ', 'Advantest Corporation ', 'Mycronic AB ', 'SPTS Technologies Ltd. ', 'Teradyne Inc. ', 'ASM International N.V. ', 'Nikon Corporation ', 'Canon Inc. ', 'BE Semiconductor Industries N.V. (Besi) ', 'Veeco Instruments Inc. ', 'Rudolph Technologies, Inc. ', 'Onto Innovation Inc. ', 'Tokyo Electron Limited'

The surging demand for semiconductor chips from manufacturers of consumer electronics, integrated health systems, and sensor equipment is causing the development of the semiconductor industry. As an increasing number of people started using consumer electronics in their daily life, smartphones, laptops, televisions, and other electronic devices, the industry is growing even bigger. To meet the growing demand for the products semiconductors are used in, consumer electronics such as telecommunications, information technology, machine automation, power & solar panel production are expected to be an essential key driver. With continuous digital content elevation and reinforcement of connectivity, as well as mobility going forward, more market areas will be opened in the next few years.

Semiconductor Fabrication Plant to be the Leading Area of Demand: Although designing process has been completed, chip manufacturing facilities called fabs or foundries are the next sites of semiconductor chips. In first manufacturing line (front-end fabrication), wafer chips are manufactured by placing them on wafer round sheets made of circular silicon or, to a minor extent, other semiconducting materials called wafers with 8- or 12-inch diameter. Integration is a process which creates a design that is as literal as the transistors, utilizing all the SMEs and materials. Stage 1, one heats up the silicon with the help of the furnace, and then the silicon is being sliced to the round disks – the wafers. Semiconductor fabrication facilities (“fabs”) make chips into wafers in two steps: low cost, high throughput, and the final products are comprised of metal interconnects between the transistors and other electrical devices in different material layers on the silicon. Working in concert, the electrical devices and interconnects (wires) supply current to the circuit. Among the top producers of the semiconductor market share and fab capacity in the world are US, Taiwan, South Korea, Japan, and China firms of which most have their headquarters and the fab locational physic still in these countries. The creation of semiconductor products is actually carried out reciprocally by multiple enterprises (which are producing the materials or coordinating the logistics). However, along with the rise in the process complexity of manufacturing of semiconductor chips also goes up the development cost. Different business models have been used by companies to reduce their costs and, thus, obtain opportunity to survive in the market of semiconductors. In November 2023, China has set up 42 lithography systems with the worth of USD 816.8 million. Information technology (IT) is a major export for the Netherlands with lithography systems totaling USD 762.7 million or about ten times the amount brought into the country last year.

Asia Pacific has the largest market share in 2023. Boom in the semiconductor output will define the region's market pace. Asia Pacific has a leading role in the semiconductor industry supply chain, as Taiwan, South Korea, and China are responsible for a bulk of global semiconductor foundry revenue. Rush in fund to semiconductor sector serves as the main impetus in China which brings about the semiconductor production equipment market stats. In September 2023, China put forward a plan for setting up a new state-directed investment fund with the purpose of mobilizing about 40 Bn US dollars to support its semiconductor industry.